Seok-Hee Lee Joins Intel Foundry as Executive Vice President

Intel has appointed Seok-Hee Lee as Executive Vice President, Intel Foundry, strengthening its leadership team as the company continues to advance its foundry capabilities and deliver next-generation semiconductor technologies.

In his new role, Lee will lead advanced packaging, system integration, and back-end technology development and manufacturing. His appointment reflects Intel's strategic focus on enhancing system-level innovation and supporting customers with increasingly sophisticated semiconductor solutions.

The move comes at a time when advanced packaging technologies are becoming a critical differentiator across the semiconductor industry. As demand for high-performance computing, artificial intelligence, and data-intensive applications continues to grow, advanced packaging and system integration are playing a larger role in improving performance, efficiency, and scalability.

Alongside Lee's appointment, Naga Chandrasekaran will continue leading front-end technology development and manufacturing operations. He will also oversee design enablement and the customer-facing and business enablement functions that support Intel Foundry's growth strategy.

The leadership transition also marks the retirement of Navid Shahriari following a distinguished 37-year career at Intel. Shahriari played a significant role in advancing the company's back-end technology and manufacturing capabilities, contributing to Intel's long-standing leadership in semiconductor innovation.

Lee's appointment underscores Intel's commitment to strengthening its foundry business and accelerating innovation across manufacturing, packaging, and system integration technologies as the company expands its position in the global semiconductor ecosystem.

About Intel Foundry

Intel Foundry is Intel's dedicated foundry business, providing semiconductor manufacturing, packaging, and technology services to customers worldwide. The organization combines advanced process technologies, manufacturing expertise, packaging innovation, and design enablement capabilities to support a broad range of computing and semiconductor applications.